Our Mission:
We are enhancing the future of computing by substantially improving the thermal conductivity of chips.
Our innovative inorganic fillers for next-generation chip packaging provide 20 times higher thermal conductivity and enhanced protection. These fillers significantly improve cooling efficiency and reduce operational surface temperatures.
Problem: Challenging Heat Management
Hundreds of transistor layers are now stacked on single chips to enhance computing power, generating significant heat. The 60-year-old packaging design struggles with this heat management. Nvidia's latest GPU, with 208 billion transistors on a chip the size of a cracker, has seen a 60% heat increase in just one year, exacerbating the problem.
Our Solution:
We leverage existing industry techniques through the integration of AI modeling and additive manufacturing.
HEXAspec specializes in manufacturing high-performance packaging fillers, ensuring precise quality control and offering customizable shapes to meet diverse needs. Our commitment to excellence and innovation allows us to provide these premium products at highly competitive costs, making HEXAspec a trusted partner for your packaging solutions.
Our Solution
HEXAspec specializes in manufacturing high-performance packaging fillers, ensuring precise quality control and offering customizable shapes to meet diverse needs. Our commitment to excellence and innovation allows us to provide these premium products at highly competitive costs, making HEXAspec a trusted partner for your packaging solutions.
HEXAspec Packaging Materials Facilitate Surface Heat Dissipation
Core Team
-
Tianshu Zhai (Sean), Ph.D. Candidate
Co-founder
-
Jing Zhang, Ph.D.
Co-founder
-
Chen-Yang Lin, Ph.D. Candidate
Co-founder
Advisory Board
-
Prof. Jun Lou, Ph.D.
Chief Science Advisor
-
Fan Ye, Ph.D.
Technical Advisor
-
Yuzhe Li (Steve)
Financial Advisor
-
Kyle Judah
Business Advisor
Partners
