Tianshu is a PhD candidate at Rice University with a passion for materials science, which began during his undergraduate studies at UIUC. He is a named inventor on the patent application for HEXAspec thermal management fillers. During his PhD, he served as the student lead at the NSF Center for Atomically Thin Multifunctional Coatings (ATOMIC), collaborating with industry leaders and national labs, and publishing in top-tier journals.

As a dedicated AI user, Tianshu is concerned about its energy and water consumption and aims to promote responsible AI development. Selected as a Rice Innovation Fellow at Liu’s Idea Lab for Innovation & Entrepreneurship, he hones his entrepreneurial skills. He was also awarded the National I-Corps as an entrepreneurial lead, during which he and his team conducted customer interviews to support market exploration of the technology. Recently, his team won first place at the Napier Rice Launch Challenge and the Rice Business Plan Competition 2024 qualifier, representing Rice University among startups from 42 universities.

Jing's doctoral research significantly advanced the synthesis, processing, and application of 2D materials, showcasing his expertise in cutting-edge materials science. Over six years in academia at Rice University, first as a postdoctoral researcher and later as a research scientist, his influential work garnered over six thousand citations, reflecting his profound impact on the field.

Recently, Jing transitioned to industry, joining Neuralink to develop brain-computer interface technology, demonstrating his commitment to groundbreaking innovation. His transition underscores his versatility, applying scientific principles to real-world applications, and pushing the boundaries of technology and neuroscience. Known for his enthusiasm and problem-solving skills, Jing brings dynamic energy to our team, driving our mission in deep tech innovation. His ability to navigate complex challenges and deliver innovative solutions makes him a valuable asset in advancing our technological capabilities.

Chen-Yang is a PhD candidate in Materials Science and NanoEngineering at Rice University with a B.S. in Chemical Engineering from National Taiwan University. He brings over five years of semiconductor industry experience, specializing in both front-end (wafer fab) and back-end (packaging) operations. At TSMC, he held R&D roles and later worked as an R&D product engineer at Powertech Inc., contributing to the development of Intel's N38A 3D NAND series.

Chen-Yang is passionate about the latest semiconductor advancements, focusing on improving heat management for future chips. His extensive industry networking includes connections with TSMC, Intel, Apple, Micron, Applied Materials, and Nvidia. Recognized with the National I-Corps award as a technical lead, he supports translational research and explores market opportunities for innovative technologies. His combination of academic prowess and industry experience makes him a valuable asset in the field of semiconductor engineering.