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Tianshu Zhai (Sean), Ph.D.
Co-Founder, Chief Executive Officer, Chief Scientist
Tianshu is the co-founder and CEO of HEXAspec, specializing in large-scale nanomaterial production and their use in electronics and protective coatings. He earned his Ph.D. in Materials Science and NanoEngineering from Rice University, where he developed HEXAspec’s patented technology and collaborated with industry leaders like EMD Electronics, Daktronics and Applied Materials. Tianshu has published 18+ papers and trained in entrepreneurship at Rice Liu Idea Lab for Innovation and Entrepreneurship (Lilie).
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Jing Zhang, Ph.D.
Co-Founder and Chief Technology Officer
Jing is the co-founder and CTO of HEXAspec, combining over ten years of cutting-edge 2D materials research at Rice University with hands-on startup experience at Neuralink. With over 6,000 citations, he’s a true materials science expert and a tech-savvy problem solver—fluent in machine learning, simulation, and experimentation. Jing brings a rare blend of academic depth and startup grit, turning advanced science into real-world deep tech innovation.
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Chen-Yang Lin, Ph.D.
Co-Founder
Chen-Yang is the co-founder of HEXAspec and will join full-time as Chief Product Officer after completing his Ph.D. at Rice University in 2026. As the team’s chip expert, he brings over five years of experience in the semiconductor industry—including roles at TSMC and Powertech—offering hands-on expertise in chip manufacturing and advanced packaging. With strong ties to chips giants like TSMC, Apple, and Micron, Chen-Yang connects cutting-edge research with real-world semiconductor innovation.
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Jun Lou, Ph.D.
Chief Science Advisor
Dr. Jun Lou is a distinguished professor in Materials Science and NanoEngineering at Rice University. With over 60,000 citations and an h-index of 113, he is a globally recognized leader in nanomaterials research. Dr. Lou directs the NSF ATOMIC Center at Rice, working with industry partners on 2D material applications. His expertise spans nanomaterial synthesis, nanomechanics, and device fabrication for energy, environmental, and biomedical uses.